Weicon epoxy glue application kit [10551025]

WEICON Epoxy Adhesive is a two-component, solvent-free adhesive with high mechanical strength and excellent bonding properties. It quickly and reliably bonds materials such as metal, wood, stone, ceramics, plastics, glass, and fiber-reinforced materials (GRP, CFRP, fiberglass). Ideal for repair and assembly tasks requiring high gap-bridging ability. The cured bond is impact-resistant, tensile-resistant, and suitable for uneven or rough surfaces.

Applications:

• bonding difficult or uneven surfaces

• service and maintenance repairs

• gap filling up to 4 mm

• joining various structural materials

Technical details:

• Base: epoxy resin

• Color: grey

• Mixing ratio (resin/hardener): 1:1

• Mixture viscosity: 300,000 mPa·s

• Max gap fill: 4 mm

• Curing temperature: +6 to +40 °C

• Open time (10 ml / 20 °C): 3–4 min

• Load bearing (50% strength): after 2 h

• Full strength: after 24 h

• Shore D hardness: 70

• Mechanical strength:
  – Adhesion: 24 MPa
  – Flexural strength: 58 MPa
  – E-Modulus: 4,000–4,500 MPa

• Linear shrinkage: 0.3 %

• Temperature resistance: -50°C to +145°C

• Thermal conductivity: 0.51 W/m·K

• ISSA-Code: 75.629.51

• IMPA-Code: 812981